BGA Assembly

PCB Assembly

TI-Electronic undertakes the production of panels mounted with BGA technology since 1997. At the BGA mounting technology there are parts assembled on the PCU, which could not be mounted using another technology due to their size or their complicated output contacts.

The most common IC methods are QFP (Quad Flat Package), TQFP (Thin Quad Flat Package), QFJ (Quad Flat J-leaded package) and BGA (Ball Grid Array). There is a significant difference between BGA and QFP technology, as at BGA the outputs have been created at the bottom of the parts.

The main disadvantage of the BGA assembly technology is the fact that analyzing the faults and repairing them has become more complicated as the outputs are invisible to the naked eye and the bindings can only be detected by using x-ray tests.