BGA Soldering Services – Precision Ball Grid Array Assembly & Inspection
Looking for expert BGA soldering services you can trust? At TI-Electronic, we specialize in high-reliability Ball Grid Array (BGA) soldering, rework, and inspection. Backed by over 30 years of experience and advanced inspection tools like X-ray imaging, we ensure your BGA assemblies are accurate, durable, and defect-free.
💡 What is BGA Soldering?
BGA (Ball Grid Array) is a type of surface-mount package that uses tiny solder balls beneath the component for electrical contact. Due to the lack of visible leads, BGA soldering requires precise equipment and inspection to ensure every joint is perfectly connected.
Key Features of BGA:
High pin count for compact designs
Better thermal & electrical performance
Used in CPUs, FPGAs, GPUs, and embedded systems
Requires X-ray inspection due to hidden joints
🛠️ Our BGA Soldering Capabilities
✅ Automated BGA placement via high-speed Yamaha Pick & Place machines
✅ Precision reflow soldering with real-time temperature profiling
✅ X-ray inspection for joint quality assurance
✅ BGA rework & repair services available
✅ Leaded and lead-free (RoHS compliant) solder options
✅ Custom profiles for complex multilayer PCBs
🔍 X-Ray Inspection for BGA Reliability
BGA joints are hidden under the package, making visual inspection impossible. We use high-resolution X-ray imaging to verify:
Proper solder joint formation
Void levels and location
Misalignment or bridging
Cold solder joints
Incomplete reflow
🔄 BGA Rework & Repair Services
Mistakes happen—even in design. That’s why we offer BGA rework solutions using:
Infrared or hot air rework stations
Vacuum pick-up & placement systems
New ball reballing service
Thermal profiling & controlled reflow
Perfect for:
Prototypes
Board modifications
Design changes
Field return repair
⚙️ Industries & Applications
Our BGA soldering services are trusted by clients in:
Industrial automation
Medical electronics
Aerospace & defense
Consumer tech & IoT
Embedded computing & AI hardware
🧪 Why Choose TI-Electronic?
🔧 30+ years of high-tech assembly expertise
🧠 In-house engineers & IPC-trained technicians
🔍 X-ray and functional test capabilities
💡 Prototype & volume production options
♻️ RoHS and non-RoHS process support
📊 Full traceability and quality reporting
❓ BGA Soldering FAQs
Do you perform BGA reballing?
→ Yes. We offer full reballing with new solder spheres.
Can you inspect voids or bridges under the BGA?
→ Yes. X-ray inspection reveals even hidden defects.
What is your BGA pitch capability?
→ We work with pitches down to 0.4 mm (fine-pitch BGA).
Do you offer lead-free BGA soldering?
→ Yes. Both SnPb and lead-free (RoHS) options are available.
📩 Request a BGA Soldering Quote
Ensure your BGA assemblies are built to last — with professional soldering, rework, and inspection from TI-Electronic.
👉 Request a Quote Now – or contact us to discuss your needs!
